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Thermal impedance of semiconductor mounted to substrate is appreciably increased at junction of porous surfaces.
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As shown above even the most highly polished mating surfaces do not make reliable contact surfaces.
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Sarcon pg45a is the lowest modulus thermal interface putty available.
These are custom cut to a smaller more applicable size.
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This line of thermal pads are much more effective than stock pads.
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The putty like material exhibits a high thermal conductivity and low thermal resistance while conforming to even the smallest protrusions and depressions on components to make complete.
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The extreme thermal pad is a ready to use high end thermal pad.
With a 11 0 watt mk thermal conductivity these pads will pull heat away from your important components with ease and allow for overclocking as well.
Find great deals on ebay for fujipoly thermal pad and fujipoly thermal pad 1 5.
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General purpose gap filler pad ul94 v 0 class.
Fujipoly is the leader in the design formulation and production of high performance thermal interface materials elastomeric connectors and custom silicone extrusions.